SiCarrier, China’s leading manufacturer of chipmaking equipment, has recently showcased an impressive array of new tools designed to boost the country’s domestic semiconductor production capabilities.
SiCarrier is emerging as a formidable force in the semiconductor industry, posing a challenge to established giants like ASML. With China’s growing ambition to enhance its semiconductor technology and production, companies like Huawei and SMIC have been at the forefront. However, SiCarrier, although lesser-known, plays a crucial role in this progression. During the SEMICON 2025 event in China, SiCarrier introduced its latest collection of equipment, signaling its determination to advance despite potential obstacles.
Captured in a tweet by user @zephyr_z9, the unveiling revealed SiCarrier’s advancements, including the development of Rapid Thermal Processing (RTP) systems, essential for fabricating integrated circuits. While the lineup covers various aspects of chip production, there was no mention of lithography tools, suggesting SiCarrier might be holding back some information. The new offerings aim to rival major players like ASML and LAM, though the effectiveness for local markets remains to be seen.
According to Du Lijun, President of SiCarrier, their domestic tools are capable of manufacturing 5nm chips. However, since they rely on non-optical technology, they face challenges such as lower yield rates, making the production costlier compared to international standards. SiCarrier is collaborating with SMIC and Huawei to address these issues, and there is optimism about a forthcoming breakthrough that could lead to significant progress in China’s pursuit of semiconductor independence.
One path being considered involves using non-optical methods, which may help tackle the current lithography hurdles. The goal is to shift the reliance away from countries that dominate the chipmaking tool market, like the Netherlands. Previously, it was reported that SiCarrier is teaming up with Huawei and the Shenzhen government to create custom EUV prototypes based on laser-induced discharge plasma technology. This effort marks the initial steps towards China developing its own EUV lithography machinery, a crucial move toward producing its most advanced semiconductor nodes.
